Samsung to mass produce vehicle ¡®eUFS¡¯ for the first time in the world¡¦Speed, safety and trust to improve
[ Park Seul Gee seul@ ] | 2017-09-27 11:36:09
128GB eUFS for the first mass produced by Samsung Electronics. Provided by Samsung Electronics
Samsung Electronics is expected to produce the world`s first 128 GB high performance flash memory `embedded universal flash storage` (eUFS). The automotive semiconductor market is expected to grow sharply as the automobile industry is competing to develop future cars such as autonomous vehicles. Samsung Electronics plans to aggressively pursue the future car industry with new semiconductor food.
Samsung Electronics, on September 26, revealed that it will mass produce `Mobile 128GB eUFS` for smartphone in January 2015, followed by eUFS memory for car. The product will be supplied to Audi.
eUFS is a built-in memory based on NAND flash. It is replacing eMMC with premium smart phone as it is faster than existing eMMC (embedded multimedia card) to read and write data.
As such, Samsung Electronics is expanding its eUFS lineup to automotive memory as semiconductor demand is expected to expand from mobile to automotive. Demand for automotive semiconductors is expected to skyrocket from autonomous navigation and infotainment systems to system semiconductors, navigation systems, and memory semiconductors that store various vehicle content. According to market researcher Gartner, the portion of total semiconductor market will grow from 9.5% in 2016 to 10.8% in 2020. From 2016 to 2020, the overall semiconductor market grew at a CAGR of 3.7%, while automotive semiconductors grew at a CAGR of 7.1%.
Samsung Electronics` 128GB eUFS is a memory product optimized for next generation ADAS (Advanced Driver Support System), infotainment and dashboard system that performs various multimedia functions through connection with smart devices.
The `128GB eUFS` for automobiles has the fastest continuous read speed of 850MB / sec and read speed of 45,000 IOPS (I / O per second) among the built-in memories, 3.4 times faster and 6.4 times faster than eMMC 5.0. It is also the same size as eMMC 5.0 and its storage capacity is doubled.
Meanwhile, this product satisfies the JEDEC (U.S. Semiconductor Standards Council) UFS 2.1 standard and implemented the `data refresh` function and `temperature sensing` function required by JEDEC UFS 3.0, which is scheduled to be standardized. It is possible to move data past a certain period to a new cell and to maintain the data reading and writing characteristics for a long time by applying the data refresh function, thereby greatly increasing the service life and increasing the reliability most important for automotive semiconductor.
Besides, the automotive memory is heat-resistant due to the heat generated by the engine and running, and the mass-produced eUFS has an internal controller with a temperature sensor to improve stability.
By Park Seul Gee seul@
